Resin Glue

1. Qingzhou duohui new material technology Co.,Ltd are the original and virgin manufacturer of the evaporative cooling pad and production plant, phenol formaldehyde resin ,white glue at Qingzhou city in Shandong province of China. we are the professional supplier of the raw material for evaprative cooling pad production locally at Qingzhou.
2.now we have our own exporting manegement department and we have the import and export license from our goverment.
3.Qingzhou duohui new material technology Co.,Ltd have strong production capacity and we can share more profits with our foreign market customer and we will provide you with the best quality goods and also the most competitive price support.

According to the application characteristics of cooling pad, using glue
polymerization and interpenetrating network technology , which make the water resistance, adhesion strength and temperature resistance of the product can be improved obviously.
With a small particle size, weather resistance, water resistance, pollution resistance and other characteristics, mainly used in cooling paper adhesive production, etc..

The phenolic resin adhesive is a red-brown liquid, which is formed by polymerization of phenol, formaldehyde and auxiliary materials at high temperature.
   The phenolic resin adhesive has good chemical stability and high viscosity and elasticity. At the same time, because of its good stability and mobility, it has good working performance and workability.
 The phenolic resin adhesive  has excellent aging resistance, water resistance, acid resistance and wrinkle resistance, this adhesive in use, non-toxic, does not contain heavy metals, no pollution, harmless to skin.

The phenolic resin adhesive is a red-brown liquid, which is formed by polymerization of phenol, formaldehyde and auxiliary materials at high temperature.

   The phenolic resin adhesive has good chemical stability and high viscosity and elasticity. At the same time, because of its good stability and mobility, it has good working performance and workability.

 The phenolic resin adhesive  has excellent aging resistance, water resistance, acid resistance and wrinkle resistance, this adhesive in use, non-toxic, does not contain heavy metals, no pollution, harmless to skin.

Urea Formaldehyde Powder Glue For Making Cooling Pad
 Urea Formaldehyde Powder Glue for Greenhouse Cellulose Pad
 The Glue Powder of Urea Formaldehyde for making cooling pad

The phenolic resin adhesive is a red-brown liquid, which is formed by polymerization of phenol, formaldehyde and auxiliary materials at high temperature, all applied in evaporative cooling pad production line. and we export to many foreign countries, such as Iran market, Southeast Asia countries,Latin American countries and Middle east market.

   The phenolic resin adhesive has good chemical stability and high viscosity and elasticity. At the same time, because of its good stability and mobility, it has good working performance and workability.

 The phenolic resin adhesive  has excellent aging resistance, water resistance, acid resistance and wrinkle resistance, this adhesive in use, non-toxic, does not contain heavy metals, no pollution, harmless to skin.

Urea Formaldehyde Powder Glue For Making Cooling Pad
 Urea Formaldehyde Powder Glue for Greenhouse Cellulose Pad
 The Glue Powder of Urea Formaldehyde for making cooling pad

Duohui phenolic formaldehyde liquid resin is widely applied in evaporative cooling pad paper production.
duohui phenolic formaldehyde liquid resin is exported to foreign market such as Iran, Iraq, Middle east countries, Southeast Asia and Latin America countries. And Duohui phenolic formaldehyde liquid resin is supplieed in Qingzhou local market for cooling pad manufacturing factories.

we provide good quality phenol formaldehyde resin for India market in large quantity and we export the resin to many other foreign countries.
The Resin is specially for evaporative cooling pads.
We also manufacture the cooling pad production line and differerent sizes of the evaporative cooling pad.