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According to the application characteristics of cooling pad, using glue polymerization and interpenetrating network technology , which make the water resistance, adhesion strength and temperature resistance of the product can be improved obviously. With a small particle size, weather resistance, water resistance, pollution resistance and other characteristics, mainly used in cooling paper adhesive production, etc..

The phenolic resin adhesive is a red-brown liquid, which is formed by polymerization of phenol, formaldehyde and auxiliary materials at high temperature.    The phenolic resin adhesive has good chemical stability and high viscosity and elasticity. At the same time, because of its good stability and mobility, it has good working performance and workability.  The phenolic resin adhesive  has excellent aging resistance, water resistance, acid resistance and wrinkle resistance, this adhesive in use, non-toxic, does not contain heavy metals, no pollution, harmless to skin.

The phenolic resin adhesive is a red-brown liquid, which is formed by polymerization of phenol, formaldehyde and auxiliary materials at high temperature.    The phenolic adhesive has good chemical stability and high viscosity and elasticity. At the same time, because of its good stability and mobility, it has good working performance and workability.   The phenolic resin Has excellent aging resistance, water resistance, acid resistance and wrinkle resistance, this adhesive in use, non-toxic, does not contain heavy metals, no pollution, harmless to skin.